Engineering the silicon-to-software continuum.
FahanTech partners with semiconductor, AI and industrial teams to take ideas from RTL to tape-out, from data to deployed models, and from concept to commissioned production line.
Three disciplines. One engineering partner.
We bring together the rare combination of semiconductor depth, AI fluency, and shop-floor pragmatism.
VLSI design & tape-out
RTL through GDSII. We close timing, sign-off DRC/LVS and partner with foundries to ship working silicon.
Learn moreData, ML & AI products
Strategy, data platforms, model development and deployment, built to plug into your real business.
Learn moreEngineering automation
Mechanical, electrical, controls and software brought together as commissioned, production-ready cells.
Learn moreA toolkit built across disciplines
Hire us for one capability or stitch them together into a single program. The handoffs disappear when the same team owns the stack.
Full silicon lifecycle
From specification and architecture to tape-out, packaging, and production test.
End-to-end ML pipelines
Data ingestion, training, validation and deployment, with monitoring built in.
Turnkey automation cells
Mechanical, electrical, controls and SCADA integrated, commissioned and supported.
Verification you can trust
DV environments, formal checks and silicon validation against your golden specs.
Platform-based design
Reusable IP and design platforms that compress your next chip's schedule.
AI-driven products
Computer vision, forecasting and generative features integrated into customer-facing apps.
A clean process, no surprises.
- 1Discover
Workshops, scoping and architecture deep-dives.
- 2Design
Specs, RTL, models or mechanical concepts, reviewed early.
- 3Build
Iterative delivery against weekly checkpoints.
- 4Validate
Verification, validation and customer sign-off.
- 5Deliver
Tape-out, deployment or on-site commissioning.