From RTL to silicon, built for what's next.
We design and verify the silicon that powers tomorrow's vehicles, connectivity, and intelligent edge, from architecture through tape-out and bring-up.
What we deliver across the stack
RTL design
Microarchitecture and synthesizable RTL for digital subsystems.
Design verification
UVM environments, coverage closure and formal property verification.
Physical design
Synthesis, floorplanning, place & route, and timing closure.
DFT & ATPG
Scan, BIST and pattern generation built for high coverage.
Tape-out support
Sign-off DRC, LVS, ERC and foundry handoff coordination.
Post-silicon validation
Bring-up, characterization, and production test programs.
Platform IP
Reusable platform IP that shortens your next design cycle.
Foundry outsourcing
We coordinate wafer fab, packaging and test partners on your behalf.
How we work, end to end
Spec & architecture
RTL & verification
Physical implementation
Sign-off & tape-out
Bring-up & ramp
Our Clients
Trusted by leading semiconductor and technology companies across the silicon lifecycle.
Clients include Google, Intel, Samsung, Qualcomm, MediaTek, Micron, Cisco, Ethernovia, Appose, Route2SoC, NextGen Silicon, Deft Solutions
What you take home
- Architecture and microarchitecture documents
- Synthesizable RTL with linting and code reviews
- Verification environment, regression suite and coverage report
- Sign-off netlists, GDSII and tape-out collateral
- Production test patterns and bring-up plan